-
1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093
-
High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015
-
Room Temperature Cure Epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. Suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1117
-
2:1 machine dispense friendly mix. A filled, room temperature cure, two component epoxy system. The product is suitable for potting / encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1158
-
Room temperature cure epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. The product is suitable for potting/encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1281